型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
H5TQ4G83CFR-RDC | SKHYNIX/海力士 | BGA | 15+ | 50 | 2025-10-22 | |||
MT48LC2M32B2TG-6:D | MICRON/美光 | TSOP | 02+ | 96 | 2025-10-22 | |||
H5TQ2G63GFR-RDC | SKHYNIX/海力士 | BGA | 19+ | 80 | 2025-10-22 | |||
S34ML01G100TFI00 | SPANSION/飞索半导体 | TSOP | 15+18+ | 94 | 2025-10-22 | |||
H5TQ4G63EFR-RDC | SKHYNIX/海力士 | BGA | 17+ | 44 | 2025-10-22 | |||
H9DA4VH2GJMMCR-4EM | SKHYNIX/海力士 | BGA | 13+ | 50 | 2025-10-22 | |||
H5TQ4G63MFR-PBC | SKHYNIX/海力士 | BGA | 13+ | 17 | 2025-10-22 | |||
BS62LV1024TC-70 | BSI | TSOP | 00+ | 1569 | 2025-10-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
K4B2G1646Q-BCNB | SAMSUNG/三星 | BGA | 16+ | 140 | 2025-10-22 | |||
M36L0T7050T3ZAQF | ST/意法 | BGA | 08+ | 1600 | 2025-10-22 | |||
BCM11109KFBG | BROADCOM/博通 | BGA | 20+21+ | 320 | 2025-10-22 | |||
NAND04GW3C2BN6E | ST/意法 | TSOP | 09+ | 283 | 2025-10-22 | |||
N78E517AFG | NUVOTON/新唐 | QFP | 12+ | 466 | 2025-10-22 | |||
FDMF3170 | ONSEMI/安森美 | QFN | 87 | 2025-10-22 | ||||
W981216BH-75 | WINBOND/华邦 | TSOP | 03+ | 1448 | 2025-10-22 | |||
W25Q32JVSIQ | WINBOND/华邦 | SOP8 | 22+ | 220 | 2025-10-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
K4B2G1646Q-BIK0 | SAMSUNG/三星 | BGA | 14+ | 30 | 2025-10-22 | |||
K4B2G1646F-BMK0 | SAMSUNG/三星 | BGA | 19+ | 20 | 2025-10-22 | |||
K4B8G1646Q-MYK0 | SAMSUNG/三星 | BGA | 18+ | 110 | 2025-10-22 | |||
NT5AD1024M8A3-HR | NANYA/南亚 | BGA | 19+ | 250 | 2025-10-22 | |||
NT5CB128M16FP-DI | NANYA/南亚 | BGA | 14+15+ | 400 | 2025-10-22 | |||
W971GG6KB-25 | WINBOND/华邦 | BGA84 | 1725+ | 300 | 2025-10-22 | |||
W632GG6NB12I | WINBOND/华邦 | BGA | 1827+ | 32 | 2025-10-22 | |||
W29N08GZBIBA | WINBOND/华邦 | BGA | 19+ | 250 | 2025-10-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
M51V18165F-60 | OKI/日冲 | TSOP | 00+ | 250 | 2025-10-22 | |||
W9425G6DH-5 | WINBOND/华邦 | TSOP | 08+ | 231 | 2025-10-22 | |||
W632GG6KB-12 | WINBOND/华邦 | BGA | 14+ | 45 | 2025-10-22 | |||
MBM29F040C-90 | FUJITSU/富士通 | TSOP | 98+ | 1154 | 2025-10-22 | |||
K4W2G1646Q-BC1A | SAMSUNG/三星 | BGA | 14+ | 131 | 2025-10-22 | |||
HM538253BJ-8 | HITACHI/日立 | SOJ | 00+ | 653 | 2025-10-22 | |||
W9812G6JH-6 | WINBOND/华邦 | TSOP | 13+ | 235 | 2025-10-22 | |||
W9864G6XH-6 | WINBOND/华邦 | TSOP | 11+ | 328 | 2025-10-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
BC6888A04-ICXL-R | CSR | BGA | 09+ | 2420 | 2025-10-22 | |||
NPC1002A2EV/C20803 | NXP/恩智浦 | BGA49 | 1748+ | 4000 | 2025-10-22 | |||
NT5CB128M8CN-CG | NANYA/南亚 | BGA | 1128+ | 174 | 2025-10-22 | |||
W971GG6JB-25 | WINBOND/华邦 | BGA | 15+ | 155 | 2025-10-22 | |||
HI3798MRQCV1010D0 | HISILICON/海思 | QFP | 17+ | 40 | 2025-10-22 | |||
74HC4067BQ | NXP/恩智浦 | QFN24 | 21+ | 330 | 2025-10-22 | |||
MAX1693EUB | MAXIM/美信 | MSOP10 | 80 | 2025-10-22 | ||||
W9812G6IH-6 | WINBOND/华邦 | TSOP | 10+ | 307 | 2025-10-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
FDMF6820A | ONSEMI/安森美 | PQFN40 | 22+ | 1080 | 2025-10-22 | |||
BCM43217TKMLG | BROADCOM/博通 | QFN | 14+ | 45 | 2025-10-22 | |||
W25Q64JVSIQ | WINBOND/华邦 | SOP8 | 22+ | 50 | 2025-10-22 | |||
MB90F462A | FUJITSU/富士通 | QFP | 17+ | 29 | 2025-10-22 | |||
OM6357EL4/3C5/8B | NXP/恩智浦 | BGA | 10+ | 50 | 2025-10-22 | |||
UPD78F0078GK-9ET | NEC/日电电子 | QFP | 08+ | 70 | 2025-10-22 | |||
S29GL032N90TFI030 | SPANSION/飞索半导体 | TSOP | 10+ | 410 | 2025-10-22 | |||
MK22FN256VLH12 | FREESCALE/飞思卡尔 | QFP64 | 16+ | 19 | 2025-10-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
N79E715AT20 | NUVOTON/新唐 | SOP | 14+ | 50 | 2025-10-22 | |||
CSD87381P | TI/德州仪器 | PTAB-5 | 20+ | 90 | 2025-10-22 | |||
L4981AD013TR | ST/意法 | SOP20 | 17+ | 82 | 2025-10-22 | |||
RT9610CGQW | RICHTEK/立锜 | QFN | 20+ | 325 | 2025-10-22 | |||
BD9F800MUX-ZE2 | ROHM/罗姆 | VQFN11 | 23+ | 148 | 2025-10-22 | |||
TLV431AIDBVR | TI/德州仪器 | SOT23-5 | 20+ | 1437 | 2025-10-22 | |||
TPS22965DSGR | TI/德州仪器 | WSON8 | 20+ | 27 | 2025-10-22 | |||
TPS40057PWPR | TI/德州仪器 | HTSSOP16 | 19+ | 35 | 2025-10-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
MCF5275CVM166 | FREESCALE/飞思卡尔 | BGA | 19+20+ | 96 | 2025-10-22 | |||
CY91F53BCEQ-GSAE2 | CYPRESS/赛普拉斯 | QFP | 1928+1936+ | 28 | 2025-10-22 | |||
MIMX8MM6DVTLZAA | FREESCALE/飞思卡尔 | BGA | 21+ | 230 | 2025-10-22 | |||
AT32F403ARGT7 | ARTERY/雅特力 | LQFP64 | 2118+ | 10 | 2025-10-22 | |||
STM32L071RBT6 | ST/意法 | QFP | 19+ | 330 | 2025-10-22 | |||
STM32F429IIH6 | ST/意法 | BGA | 16+ | 3 | 2025-10-22 | |||
STM32F030K6T6 | ST/意法 | LQFP32 | 19+ | 44 | 2025-10-22 | |||
TMS320F28035PNT | TI/德州仪器 | QFP | 23+ | 158 | 2025-10-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
K4B2G1646E-BQK0 | SAMSUNG/三星 | BGA | 14+ | 78 | 2025-10-22 | |||
74LCX00MTCX | ONSEMI/安森美 | TSSOP14 | 16+ | 388 | 2025-10-22 | |||
S29AL016D90TAI020 | SPANSION/飞索半导体 | TSOP | 0601+ | 1920 | 2025-10-22 | |||
S25FL512SAGMFB013 | SPANSION/飞索半导体 | SOP16 | 21+ | 59 | 2025-10-22 | |||
SPCA1521A-HL091 | SUNPLUS/凌阳 | QFP | 12+ | 24 | 2025-10-22 | |||
PI3B3245LEX | DIODES/美台 | TSSOP20 | 2127+ | 218 | 2025-10-22 | |||
TXS0102DQER | TI/德州仪器 | X2SON-8 | 20+ | 110 | 2025-10-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
W25Q64FWBYIG | WINBOND/华邦 | WLCSP-16 | 19+ | 495 | 2025-10-22 | |||
MT29F8G08ABACAWP-IT:C | MICRON/美光 | TSOP | 14+ | 44 | 2025-10-22 | |||
KLM8G1GETF-B041 | SAMSUNG/三星 | BGA | 20+24+ | 47 | 2025-10-22 | |||
M25P128-VMF6TPB | MICRON/美光 | SOP16 | 16+ | 100 | 2025-10-22 | |||
MX25L3233FM2I-08G | MXIC/旺宏 | SOP8 | 21+22+ | 122 | 2025-10-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
TB28F400B5T80 | INTEL/英特尔 | SOP | 202+ | 10 | 2025-10-22 | |||
TB28F400B5B80 | INTEL/英特尔 | SOP | 049+ | 80 | 2025-10-22 | |||
TB28F008SA-100 | INTEL/英特尔 | SOP | 93+ | 3140 | 2025-10-22 | |||
T54C364164VT-6 | TIC | TSOP | 0315+ | 540 | 2025-10-22 | |||
T431616A-7S | TMT | TSOP | 01+/02+ | 175 | 2025-10-22 | |||
T224162B-35J | TKS/兴勤 | SOJ | 0131+ | 342 | 2025-10-22 | |||
T224162B-20J | TKS/兴勤 | SOJ | 99+ | 25 | 2025-10-22 | |||
T14M256A-12J | TKS/兴勤 | SOJ | 0534+ | 4275 | 2025-10-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
K4B2G1646Q-BCNB | SAMSUNG/三星 | BGA | 16+ | 140 | 2025-10-22 | |||
EP2S60F672I4 | ALTERA/阿尔特拉 | BGA | 09+ | 1 | 2025-10-22 | |||
EP1AGX90EF1152C6N | ALTERA/阿尔特拉 | BGA | 11+ | 1 | 2025-10-22 | |||
EPM2210F324C3N | ALTERA/阿尔特拉 | BGA | 11+ | 2 | 2025-10-22 | |||
K4D261638K-LC50 | SAMSUNG/三星 | TSOP | 07+ | 34 | 2025-10-22 | |||
K4B8G1646B-MYK0 | SAMSUNG/三星 | BGA | 13+ | 45 | 2025-10-22 | |||
MBM29LV400BC-90PFTN | FUJITSU/富士通 | TSOP | 0050+ | 756 | 2025-10-22 | |||
MBM29LV400BC-70PFTN | FUJITSU/富士通 | TSOP | 0303+ | 3648 | 2025-10-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
AM29F200BB-90SC | ADVANCED MICRO DEVICES | SOP | 07+ | 260 | 2025-10-22 | |||
AM29F200BB-90EC | ADVANCED MICRO DEVICES | TSOP | 99+ | 38 | 2025-10-22 | |||
AM29F200BB-70SC | ADVANCED MICRO DEVICES | SOP | 07+ | 1000 | 2025-10-22 | |||
AM29F100B-70EC | ADVANCED MICRO DEVICES | TSOP | 9922+ | 1241 | 2025-10-22 | |||
AM29F080B-90EI | ADVANCED MICRO DEVICES | TSOP | 0820+ | 407 | 2025-10-22 | |||
AM29F080B-90EC | ADVANCED MICRO DEVICES | TSOP | 9946+ | 330 | 2025-10-22 | |||
AM29F080B-120EC | ADVANCED MICRO DEVICES | TSOP | 00+/02+ | 154 | 2025-10-22 | |||
MBM29F040C-70 | FUJITSU/富士通 | 120 | 2025-10-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
THGBMAG7A2JBAIR | TOSHIBA/东芝 | 13+ | 171 | 2025-10-22 | ||||
K9LBG08U0M-PCB0 | SAMSUNG/三星 | TSOP | 09+ | 14 | 2025-10-22 | |||
K9F2G08U0C-SCB0 | SAMSUNG/三星 | TSOP | 11+/14+ | 75 | 2025-10-22 | |||
MT41K256M16TW-093:P | MICRON/美光 | BGA | 16+ | 8 | 2025-10-22 | |||
MT41K512M8RH-125 | MICRON/美光 | BGA | 13+ | 52 | 2025-10-22 | |||
MT41K512M8RG-107:N | MICRON/美光 | BGA | 14+/15+ | 4186 | 2025-10-22 | |||
MT46V32M16P-6T:F | MICRON/美光 | TSOP | 06+ | 20 | 2025-10-22 | |||
MT46V32M16P-5B | MICRON/美光 | TSOP | 1208+ | 279 | 2025-10-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
R5F562TADDFP | RENESAS/瑞萨 | QFP | 20+ | 5 | 2025-10-22 | |||
R5F3650ENFB | RENESAS/瑞萨 | QFP | 09+ | 6 | 2025-10-22 | |||
MPC8377VRANGA | FREESCALE/飞思卡尔 | BGA | 15+ | 13 | 2025-10-22 | |||
MIMXRT1061DVL6A | FREESCALE/飞思卡尔 | BGA | 20+ | 4 | 2025-10-22 | |||
MIMXRT1064DVL6A | FREESCALE/飞思卡尔 | BGA | 20+ | 22 | 2025-10-22 | |||
MIMXRT1062DVL6A | FREESCALE/飞思卡尔 | BGA | 20+ | 3 | 2025-10-22 | |||
MP1482DN | MPS/美国芯源 | SOP | 21 | 2025-10-22 | ||||
AT89S52-24PC | ATMEL/爱特梅尔 | DIP | 0523+ | 37 | 2025-10-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
HI3716MRQCV301000 | HISILICON/海思 | QFP | 15+ | 2 | 2025-10-22 | |||
HI3515CRQCV100 | HISILICON/海思 | QFP | 7 | 2025-10-22 | ||||
HI3520DRQCV200 | HISILICON/海思 | QFP | 2021+ | 2 | 2025-10-22 | |||
HI3520DRQCV300 | HISILICON/海思 | QFP | 18+ | 6 | 2025-10-22 | |||
S29GL032N90TFI030 | SPANSION/飞索半导体 | TSOP | 10+ | 410 | 2025-10-22 | |||
TW8825-LA1-CR | INTERSIL | QFP | 16+ | 24 | 2025-10-22 | |||
MPC8313VRAFFC | FREESCALE/飞思卡尔 | BGA | 1 | 2025-10-22 | ||||
H5MS2562NFR-J3M | SKHYNIX/海力士 | BGA | 13+ | 206 | 2025-10-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
TC58BVG0S3HTA00 | TOSHIBA/东芝 | TSOP | 13+ | 48 | 2025-10-22 | |||
TSB41LV06APZP | TI/德州仪器 | QFP | 10+ | 12 | 2025-10-22 | |||
S29GL256S11TFIV20 | SPANSION/飞索半导体 | TSOP | 21+ | 1 | 2025-10-22 | |||
TUSB8041RGCR | TI/德州仪器 | VQFN64 | 21+ | 7 | 2025-10-22 | |||
TUSB8041ARGCR | TI/德州仪器 | VQFN64 | 21+ | 2 | 2025-10-22 | |||
SII9233ACTU | LATTICE/莱迪斯 | QFP | 19+ | 1 | 2025-10-22 | |||
SP3243EEA | EXAR/艾科嘉 | SOP | 1025+ | 9 | 2025-10-22 | |||
SN65LVPE502ARGER | TI/德州仪器 | QFN | 21+ | 10 | 2025-10-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
HEF4052BT | NXP/恩智浦 | SOP | 110 | 2025-10-22 | ||||
S29GL256P90TFIR2 | SPANSION/飞索半导体 | TSOP | 10+ | 680 | 2025-10-22 | |||
S29GL064A90TFIR4 | SPANSION/飞索半导体 | TSOP | 0648+/0703+ | 28 | 2025-10-22 | |||
S29GL512S11TFIV2 | SPANSION/飞索半导体 | TSOP | 18+ | 39 | 2025-10-22 | |||
S29GL128N11TFI02 | SPANSION/飞索半导体 | TSOP | 12+ | 40 | 2025-10-22 | |||
S29GL128P90TFIR2 | SPANSION/飞索半导体 | TSOP | 1743+ | 3 | 2025-10-22 | |||
KFM1G16Q2D-HEB8 | SAMSUNG/三星 | BGA | 11+ | 1293 | 2025-10-22 | |||
S29GL064M90TFIR4 | SPANSION/飞索半导体 | TSOP | 06+ | 96 | 2025-10-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
UCC3818AD | TI/德州仪器 | SOP16 | 16+ | 28 | 2025-10-22 | |||
UCD90320UZWST | TI/德州仪器 | BGA | 19+ | 7 | 2025-10-22 | |||
MMPF0100F0AEP | NXP/恩智浦 | QFN | 4 | 2025-10-22 | ||||
BQ24133RGYR | TI/德州仪器 | VQFN-24 | 7 | 2025-10-22 | ||||
BQ24715RGRR | TI/德州仪器 | VQFN20 | 19+ | 80 | 2025-10-22 | |||
MP2315GJ-Z | MPS/美国芯源 | SOT23-8 | 20+ | 77 | 2025-10-22 | |||
R5F364AMNFB | RENESAS/瑞萨 | QFP | 08+ | 9 | 2025-10-22 | |||
BM1C102F-GE2 | ROHM/罗姆 | SOP18 | 23+ | 36 | 2025-10-22 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
MPC8321VRAFDCA | FREESCALE/飞思卡尔 | BGA | 17+ | 1 | 2025-10-22 | |||
MPC8248VRTIEA | FREESCALE/飞思卡尔 | BGA | 4 | 2025-10-22 | ||||
MPC8314VRAGDA | FREESCALE/飞思卡尔 | BGA | 2 | 2025-10-22 | ||||
MPC8541EVTAPF | FREESCALE/飞思卡尔 | BGA | 1 | 2025-10-22 | ||||
STM32F412VET6 | ST/意法 | QFP | 42 | 2025-10-22 | ||||
STM32F205ZCT6 | ST/意法 | QFP | 1 | 2025-10-22 | ||||
STM32F103ZET6 | ST/意法 | QFP | 17+ | 6 | 2025-10-22 | |||
STM32F205ZGT6 | ST/意法 | QFP | 17+ | 2 | 2025-10-22 |